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How to do the bad phenomenon caused by the silicon keypad uncooked lack of material?

硅胶按键

1、Low mold temperature: Increase the mold temperature appropriately.

2、Insufficient sulphur addition time: increase the sulphur addition time.

3、The raw material is placed too long: re-mix the material and discharge it.

4、Bad exhaust: adjust the exhaust distance and times, use the second exhaust at the right time, or change the mold cloth.

5, the time outside the mold is too long: action to speed up or increase the manpower, while the mold temperature can be properly adjusted.

6, machine failure, such as temperature control failure, exhaust control failure: repair the machine.

7, mold temperature is too high resulting in the package wind: appropriate to reduce the mold temperature

8、The release agent or water playing too much uneven: appropriate playing water

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