Specifications: 1.2T*17*17MM (size can be cut according to user requirements)

Material: Fiberglass base material

Application: between semiconductor and heat sink, communication products, automobile, computer, LED lighting, etc.

Features: thermal conductivity, insulation, shockproof

Use: Used for control motherboard of electronic and electrical products, internal and external pads and foot pads of motors, electronic appliances, automotive machinery, computer hosts, laptops, DVDs, VCDs and any materials that need to be filled as well as heat dissipation modules. Customers can choose the right thickness of heat-conducting silicone film according to the size of the gap between the heat-generating body and the heat sink, the color is adjustable, and the area size and thickness are optional.
　　1、TFT-LCD laptop, computer host
　　2、Power devices (power supply, computers, telecommunications), automotive electronic modules (engine wipers) power modules, high-power power supplies, calculator applications (CPU, GPU, USICS, hard drives) and any place that needs to be filled with heat dissipation
　　3, for electronic products, electronic equipment, heat generating power devices (integrated circuits, power tubes, SCR, transformers, etc.) and heat dissipation facilities (heat sink, aluminum housing, etc.) in close contact with each other to achieve better thermal conductivity
　　4, high-power LED lighting, high-power LED spotlights, street lamps, fluorescent lamps, etc.