Silicone keys often appear some such and such problems, the following Shenzhen silicone products factory for you to sort out a few, and give the relevant recommended answers:.

Problem 1: conductive particles relative to the mold is small: change the larger conductive or Teflon auxiliary discharge; conductive particles relative to the mold is large: change the smaller conductive or conductive baking and then use the cloth group to beat the conductive particles and then row.
Conductive grain not played solid, or not into the guide and then use Teflon auxiliary discharge; conductive cavity shallow: with a thinner conductive molding.
Solution: appropriate to reduce the exhaust distance, the number of times and mold speed (such as low exhaust) to solve, but also out of thin material molding.
1、Conductive grain leakage: check whether the conductivity is put together before the material is discharged.
2, the product KEY higher: conductive size of small appropriate to reduce the exhaust distance, with low-pressure exhaust, less water spray.
3、Conductive cavity shallow, the conductive material with Teflon auxiliary discharge when closing the mold.

Question 2: The silicone keypad is not good for the bean removal.
Solution.
1, the mold temperature is not appropriate to adjust (raise) the mold temperature.
2, add sulfur time is not enough to properly lengthen the time to add sulfur.
3, the exhaust is not good to properly adjust the exhaust distance and times.
4、The conductive cavity is shallow to use thin conductive grain.
5, conductive for too long, the appearance has been ground out of the powder to use the new conductive, the old conductive with sprinkling essence washed and dried again.
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